International Journal For Research In Electronics & Electrical Engineering (ISSN: 2208-2735) https://gnpublication.org/index.php/eee <p>Green Publication provides high quality research journals with monthly frequency, open access and double blind peer-reviewed. Green Publication providing a platform for the researchers, academicians, professional, practitioners and students to impart and share knowledge in the form of high quality empirical and theoretical research papers, case studies, literature reviews and book reviews.<br><span style="font-size: 1.5em;"><strong> <span style="color: black; text-shadow: #048204 0px 0px 3px;">Current Impact Factor: 2.872</span></strong></span></p> en-US <p>In consideration of the journal, Green Publication taking action in reviewing and editing our manuscript, the authors undersigned hereby transfer, assign, or otherwise convey all copyright ownership to the Editorial Office of the Green Publication in the event that such work is published in the journal. Such conveyance covers any product that may derive from the published journal, whether print or electronic. Green Publication shall have the right to register copyright to the Article in its name as claimant, whether separately <br>or as part of the journal issue or other medium in which the Article is included.</p> <p>By signing this Agreement, the author(s), and in the case of a Work Made For Hire, the employer, jointly and severally represent and warrant that the Article is original with the author(s) and does not infringe any copyright or violate any other right of any third parties, and that the Article has not been published elsewhere, and is not being considered for publication elsewhere in any form, except as provided herein. Each author’s signature should appear below. The signing author(s) (and, in editor@gnpublication.org (Virender Singh) info@gnpublication.org (Rajbir Singh) Tue, 03 Apr 2018 00:00:00 +0000 OJS 3.1.2.0 http://blogs.law.harvard.edu/tech/rss 60 MEMS Retroreflector Fabrication and Packaging https://gnpublication.org/index.php/eee/article/view/372 <p>Integration of 3-D devices, IC or MEMS, often requires a handle wafer which is removed before final packaging of the devices. This process usually uses lapping, chemical etch or high temperature heating to de-bond the handle wafer. A new technique to release a Pyrex handle wafer using laser ablation is presented. Pulsed energy, from a 248nm excimer laser is delivered transparently through the Pyrex handle wafer. This causes delamination of the bonded silicon structures from the handle wafer. This technique offers fast throughput at chip and wafer levels and protects the fragile and delicate active devices from harsh physical, chemicals and potential thermal stresses. We present a method wherein the handle wafer used in 3-D assembly of a MEMS device was released using laser micromachining. A Pyrex handle wafer rigidly supports anisotropically etched, through-silicon wafer, vertical mirrors during thermo-compression bonding to active MEMS parts. After this first thermo-compression bond, the Pyrex handle wafer was lifted off using laser ablation, leaving clearance for additional bond steps, which includes additional components and a package frame. Multiple Au-Au thermo-compression bonds of vertical surfaces onto a single MEMS chip were performed, to assemble and package 3-D MEMS devices.</p> Wang Wei, Li Jiang, Feng Mian Copyright (c) 2018 International Journal For Research In Electronics & Electrical Engineering https://gnpublication.org/index.php/eee/article/view/372 Sat, 31 Mar 2018 00:00:00 +0000